The topics of interest for submission include, but are not limited to:
High Performance Polymer Materials
Graphene and Carbon Nanotubes
Flexible and Stretchable Materials
Biocompatible Materials
Smart Materials
Lithography Innovations
Ion Beam Etching
Deep Reactive Ion Etching (DRIE)
Micromachining
Laser Micromachining Technology
Nano 3D Printing
Multi-Material 3D Printing
High Resolution 3D Printing
Picosecond Laser 3D Printing
Material Selection and Optimization for 3D Printing
Chemical Vapor Deposition (CVD)
Physical Vapor Deposition (PVD)
Atomic Layer Deposition (ALD)
Electroplating and Electrochemical Deposition
Surface Plasma Treatment
Smart Packaging Technology
Low Temperature Packaging
Microfluidic Packaging
Multi-chip integrated packaging
Wireless self-powered MEMS package