The topics of interest for submission include, but are not limited to:
◕ High Performance Polymer Materials Graphene and Carbon Nanotubes Flexible and Stretchable Materials Biocompatible Materials Smart Materials Lithography Innovations Ion Beam Etching Deep Reactive Ion Etching (DRIE) Micromachining Laser Micromachining Technology Nano 3D Printing Multi-Material 3D Printing High Resolution 3D Printing Picosecond Laser 3D Printing Material Selection and Optimization for 3D Printing |
◕ Chemical Vapor Deposition (CVD) Physical Vapor Deposition (PVD) Atomic Layer Deposition (ALD) Electroplating and Electrochemical Deposition Surface Plasma Treatment Smart Packaging Technology Low Temperature Packaging Microfluidic Packaging Multi-chip integrated packaging Wireless self-powered MEMS package |